发明授权
- 专利标题： Electrostatic chuck
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申请号： US16034600申请日： 2018-07-13
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公开(公告)号： US10896836B2公开(公告)日： 2021-01-19
- 发明人: Kenta Chito , Hidekazu Iida , Tomohiro Yamada , Yoshiteru Nishida , Hiroyuki Takahashi , Ryoko Fujiya , Susumu Yokoo
- 申请人： DISCO CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： DISCO CORPORATION
- 当前专利权人： DISCO CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Greer Burns & Crain Ltd.
- 优先权： JP2017-137501 20170714
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H01L21/67 ; H01L21/3065 ; H01L21/687
摘要：
An electrostatic chuck is provided and has a holding surface for holding a wafer with a tape attached to one side of the wafer where the tape is in contact with the holding surface. The electrostatic chuck includes a disk-shaped member having a plurality of fine holes communicating with a vacuum source, where the fine holes are exposed to the holding surface. The disk-shaped member also includes a plurality of asperities formed on the holding surface and connected to the fine holes, and an electrode embedded in the disk-shaped member. The vacuum source is operated to produce a vacuum on the holding surface through the fine holes and thereby hold the wafer through the tape on the holding surface under suction, where the asperities formed on the holding surface function as a suction passage communicating with the fine holes.
公开/授权文献
- US20190019712A1 ELECTROSTATIC CHUCK 公开/授权日：2019-01-17
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