- 专利标题： Semiconductor package
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申请号： US16163614申请日： 2018-10-18
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公开(公告)号： US10784206B2公开(公告)日： 2020-09-22
- 发明人: Wen-Sung Hsu , Tao Cheng , Nan-Cheng Chen , Che-Ya Chou , Wen-Chou Wu , Yen-Ju Lu , Chih-Ming Hung , Wei-Hsiu Hsu
- 申请人： MEDIATEK Inc.
- 申请人地址： TW Hsinchu
- 专利权人： MEDIATEK INC.
- 当前专利权人： MEDIATEK INC.
- 当前专利权人地址： TW Hsinchu
- 代理机构： McClure, Qualey & Rodack, LLP
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/683 ; H01Q9/04 ; H01L23/498 ; H01Q1/22 ; H01L23/31 ; H01L25/10 ; H01L23/50 ; H01Q21/06 ; H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L25/00 ; H01L25/065 ; H01L25/16 ; H01L23/66 ; H01L23/14
摘要：
A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
公开/授权文献
- US20190051609A1 SEMICONDUCTOR PACKAGE 公开/授权日：2019-02-14
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