Invention Grant
- Patent Title: Silicon carbide epitaxial substrate and silicon carbide semiconductor device
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Application No.: US16375455Application Date: 2019-04-04
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Publication No.: US10774441B2Publication Date: 2020-09-15
- Inventor: Yu Nakamura , Kazuya Konishi
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@174c1b9d
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L31/0312 ; C30B25/20 ; C30B29/36 ; H01L29/36 ; H01L29/78 ; H01L29/861 ; H01L29/08 ; H01L29/16 ; C30B25/18 ; H01L21/02 ; H01L29/66 ; H01L21/205 ; H01L29/06

Abstract:
A silicon carbide epitaxial substrate includes a silicon carbide single-crystal substrate of one conductivity type, a first silicon carbide layer of the above-mentioned one conductivity type, a second silicon carbide layer of the above-mentioned one conductivity type, and a third silicon carbide layer of the above-mentioned one conductivity type. The silicon carbide single-crystal substrate has first impurity concentration. The first silicon carbide layer is provided on the silicon carbide single-crystal substrate, and has second impurity concentration that is lower than the first impurity concentration. The second silicon carbide layer is provided on the first silicon carbide layer, and has third impurity concentration that is higher than the first impurity concentration. The third silicon carbide layer is provided on the second silicon carbide layer, and has fourth impurity concentration that is lower than the second impurity concentration.
Public/Granted literature
- US10738393B2 Silicon carbide epitaxial substrate and silicon carbide semiconductor device Public/Granted day:2020-08-11
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