Invention Grant
- Patent Title: Semiconductor devices
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Application No.: US15955256Application Date: 2018-04-17
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Publication No.: US10741574B2Publication Date: 2020-08-11
- Inventor: Kwangyoung Jung , Jongwon Kim , Dongseog Eun , Joonhee Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@551c3a51
- Main IPC: H01L27/11568
- IPC: H01L27/11568 ; H01L27/11582 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H01L27/11565 ; H01L27/11575

Abstract:
Semiconductor devices are provided. A semiconductor device includes a substrate. The semiconductor device includes a stack structure including conductive layers stacked on the substrate. Moreover, the semiconductor device includes a dummy structure penetrating a stepped region of the stack structure. A portion of the dummy structure includes a first segment and a second segment. The first segment extends in a first direction in a plane parallel to an upper surface of the substrate. The second segment protrudes from the first segment in a second direction, in the plane, that intersects the first direction.
Public/Granted literature
- US20190035806A1 SEMICONDUCTOR DEVICES Public/Granted day:2019-01-31
Information query
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