Invention Grant
- Patent Title: Method and apparatus for depositing cobalt in a feature
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Application No.: US16222630Application Date: 2018-12-17
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Publication No.: US10714388B2Publication Date: 2020-07-14
- Inventor: Jin Hee Park , Tae Hong Ha , Sang-Hyeob Lee , Thomas Jongwan Kwon , Jaesoo Ahn , Xianmin Tang , Er-Xuan Ping , Sree Kesapragada
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/285 ; C23C16/48 ; C23C16/455 ; C23C16/04 ; C23C16/16 ; C23C16/18 ; C23C16/56 ; H01L21/67 ; H01L23/532 ; H01L27/11556 ; H01L27/11582

Abstract:
Methods and apparatus for depositing a cobalt layer in a feature, such as, a word line formed in a substrate, are provided herein. In some embodiments, method of processing a substrate includes: exposing a substrate at a first temperature to a cobalt containing precursor to deposit a cobalt layer within a word line feature formed in the substrate, wherein the word line feature is part of a 3D NAND device; and annealing the substrate to remove contaminants from the cobalt layer and to reflow the cobalt layer into the word line feature, wherein the substrate is at a second temperature greater than the first temperature during the annealing.
Public/Granted literature
- US20190122924A1 METHOD AND APPARATUS FOR DEPOSITING COBALT IN A FEATURE Public/Granted day:2019-04-25
Information query
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