Invention Grant
- Patent Title: Inspection device for inspecting wafer and method of inspecting wafer using the same
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Application No.: US15724758Application Date: 2017-10-04
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Publication No.: US10474133B2Publication Date: 2019-11-12
- Inventor: Janghee Lee , Yoo Jin Jeong , Sangbong Park , Byeonghwan Jeon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2016-0160761 20161129
- Main IPC: G05B19/4097
- IPC: G05B19/4097 ; G01N21/95 ; G03F7/20 ; H01L21/66 ; H01L21/67

Abstract:
An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.
Public/Granted literature
- US20180150057A1 INSPECTION DEVICE FOR INSPECTING WAFER AND METHOD OF INSPECTING WAFER USING THE SAME Public/Granted day:2018-05-31
Information query
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