- 专利标题: Semiconductor devices and methods of fabricating the same
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申请号: US15882190申请日: 2018-01-29
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公开(公告)号: US10418284B2公开(公告)日: 2019-09-17
- 发明人: Chul Woong Lee , Hanseung Kwak , Youngmook Oh
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel, P.A.
- 优先权: KR10-2015-0103120 20150721
- 主分类号: H01L21/8234
- IPC分类号: H01L21/8234 ; H01L29/06 ; H01L27/088 ; H01L27/11 ; H01L27/02
摘要:
Semiconductor devices and methods of fabricating the same are provided. The semiconductor devices may include gate electrodes on a substrate. A longitudinal direction of each of the gate electrodes may extend in a first direction, and ones of the gate electrodes may be arranged in the first direction. The semiconductor devices may also include first and second gate spacers extending in the first direction and on respective sidewalls of the ones of the gate electrodes. The first and second gate spacers may be spaced apart from each other in a second direction that is different from the first direction. The semiconductor devices may further include gate separation patterns, and ones of the gate separation patterns may be between two among the ones of the gate electrodes adjacent to each other in the first direction and between the first and second gate spacers.
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