Invention Grant
- Patent Title: Composite semiconductor substrate
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Application No.: US15556531Application Date: 2016-01-14
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Publication No.: US10186421B2Publication Date: 2019-01-22
- Inventor: Akira Fukazawa , Mitsuhisa Narukawa , Keisuke Kawamura
- Applicant: AIR WATER INC.
- Applicant Address: JP
- Assignee: AIR WATER INC.
- Current Assignee: AIR WATER INC.
- Current Assignee Address: JP
- Agency: Wood, Phillips, Katz, Clark & Mortimer
- Priority: JP2015-046375 20150309
- International Application: PCT/JP2016/050987 WO 20160114
- International Announcement: WO2016/143381 WO 20160915
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L21/02 ; H01L21/20 ; H01L21/205 ; H01L29/812 ; H01L29/267 ; H01L29/45 ; H01L29/47

Abstract:
A composite semiconductor substrate being able to improve voltage withstanding and crystalline quality is provided. A composite semiconductor substrate is equipped with an Si (silicon) substrate, an SiC (silicon carbide) layer formed on the surface of the Si substrate, an AlN (aluminum nitride) layer formed on the surface of the SiC layer, a composite layer formed on the surface of the AlN layer, and a GaN (gallium nitride) layer formed on the surface of the composite layer. The composite layer includes an AlN (aluminum nitride) layer and a GaN layer formed on the surface of the AlN layer. In at least one composite layer, the average density of C and Fe in the GaN layer is higher than the average density of C and Fe in the AlN layer.
Public/Granted literature
- US20180053647A1 COMPOSITE SEMICONDUCTOR SUBSTRATE Public/Granted day:2018-02-22
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