- 专利标题： Method for metalizing polymer substrate and polymer article prepared thereof
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申请号： US15217730申请日： 2016-07-22
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公开(公告)号： US10179949B2公开(公告)日： 2019-01-15
- 发明人: Qing Gong , Wei Zhou , Yongliang Sun
- 申请人： BYD COMPANY LIMITED
- 申请人地址： CN Shenzhen
- 专利权人： BYD Company Limited
- 当前专利权人： BYD Company Limited
- 当前专利权人地址： CN Shenzhen
- 代理机构： Sheppard Mullin Richter & Hampton LLP
- 优先权： CN201410040525 20140127; CN201410040821 20140127; CN201410041075 20140127
- 主分类号： B05D3/00
- IPC分类号： B05D3/00 ; C08J7/18 ; G21H5/00 ; C23C18/18 ; C23C18/16 ; C23C18/20 ; C23C18/40 ; C08K3/20 ; C23C18/36 ; C23C18/54 ; C08K3/22
摘要：
A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.
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