- 专利标题: Semiconductor device structure and method for forming the same
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申请号: US15475294申请日: 2017-03-31
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公开(公告)号: US10164037B2公开(公告)日: 2018-12-25
- 发明人: Ker-Hsiao Huo , Kong-Beng Thei , Chih-Wen Albert Yao , Fu-Jier Fan , Chen-Liang Chu , Ta-Yuan Kung , Yi-Huan Chen , Yu-Bin Zhao , Ming-Ta Lei , Li-Hsuan Yeh
- 申请人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 主分类号: H01L29/423
- IPC分类号: H01L29/423 ; H01L21/28 ; H01L29/40 ; H01L29/06 ; H01L29/08
摘要:
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having a top surface, a source region, and a drain region. The semiconductor device structure includes a gate structure over the top surface and extending into the semiconductor substrate. The gate structure in the semiconductor substrate is between the source region and the drain region and separates the source region from the drain region. The semiconductor device structure includes an isolation structure in the semiconductor substrate and surrounding the source region, the drain region, and the gate structure in the semiconductor substrate.
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