- 专利标题: Connection structure for vertical gate all around (VGAA) devices on semiconductor on insulator (SOI) substrate
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申请号: US15479598申请日: 2017-04-05
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公开(公告)号: US10157934B2公开(公告)日: 2018-12-18
- 发明人: Jhon-Jhy Liaw
- 申请人: Taiwan Semiconductor Manufacturing Company Limited
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人: Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人地址: TW Hsinchu
- 代理机构: Jones Day
- 主分类号: H01L27/00
- IPC分类号: H01L27/00 ; H01L27/12 ; H01L29/423 ; H01L27/11 ; H01L29/06 ; H01L23/522 ; H01L23/528 ; H01L27/092 ; H01L29/45 ; H01L29/78 ; H01L27/118
摘要:
A vertical gate all around (VGAA) nanowire device circuit routing structure is disclosed. The circuit routing structure comprises a plurality of VGAA nanowire devices including a NMOS and a PMOS device. The devices are formed on a semiconductor-on-insulator substrate. Each device comprises a bottom plate and a top plate wherein one of the bottom and top plates serves as a drain node and the other serves as a source node. Each device further comprises a gate layer. The gate layer fully surrounds a vertical channel in the device. In one example, a CMOS circuit is formed with an oxide (OD) block layer that serves as a common bottom plate for the NMOS and PMOS devices. In another example, a CMOS circuit is formed with a top plate that serves as a common top plate for the NMOS device and the PMOS devices. In another example, a SRAM circuit is formed.
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