- 专利标题: Semiconductor device and method for manufacturing same
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申请号: US15570841申请日: 2016-04-05
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公开(公告)号: US10134593B2公开(公告)日: 2018-11-20
- 发明人: Takeshi Endo , Atsuya Akiba , Yuichi Takeuchi , Hidefumi Takaya , Sachiko Aoi
- 申请人: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA
- 申请人地址: JP Kariya JP Toyota-shi
- 专利权人: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA
- 当前专利权人: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA
- 当前专利权人地址: JP Kariya JP Toyota-shi
- 代理机构: Posz Law Group, PLC
- 优先权: JP2015-110269 20150529
- 国际申请: PCT/JP2016/001907 WO 20160405
- 国际公布: WO2016/194280 WO 20161208
- 主分类号: H01L29/00
- IPC分类号: H01L29/00 ; H01L21/20 ; H01L21/265 ; H01L29/78 ; H01L29/06 ; H01L29/12 ; H01L29/08 ; H01L29/16 ; H01L21/00 ; H01L21/04
摘要:
A semiconductor device includes: a substrate having a cell region with a semiconductor element and an outer peripheral region; and a drift layer on the substrate. The semiconductor element includes a base region, a source region, a trench gate structure, a deep layer deeper than a gate trench, a source electrode, and a drain electrode. The outer peripheral region has a recess portion in which the drift layer are exposed, and a guard ring layer. The guard ring layer includes multiple guard ring trenches having a frame shape, surrounding the cell region and arranged on an exposed surface of the drift layer, and a first guard ring in the guard ring trenches. Each of the linear deep trenches has a width equal to a width of each of the linear guard ring trenches.
公开/授权文献
- US20180151366A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 公开/授权日:2018-05-31
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