- 专利标题： Method for producing a circuit carrier and for connecting an electrical conductor to a metallization layer of a circuit carrier
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申请号： US14751361申请日： 2015-06-26
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公开(公告)号： US10092974B2公开(公告)日： 2018-10-09
- 发明人: Mark Essert , Marianna Nomann , Thomas Nuebel , Guido Strotmann
- 申请人： Infineon Technologies AG
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Murphy, Bilak & Homiller, PLLC
- 优先权： DE102014109183 20140701
- 主分类号： B23K20/00
- IPC分类号： B23K20/00 ; B23K20/10 ; B23K20/22 ; H05K3/32 ; B23K101/38 ; H05K1/02 ; H05K1/03
摘要：
One aspect of the invention relates to a method for producing a circuit carrier. For this purpose, an electrically insulating carrier is provided, having an upper side and also an underside opposite from the upper side. A first metal foil and a hardening material are likewise provided. Then, an upper metallization layer, which is arranged on the upper side and has a hardening area, is produced. In this case, at least one contiguous portion of the hardening area is created by at least part of the hardening material being diffused into the first metal foil.
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