Provided is a module with embedded electronic components which prevents the short-circuit failure in the step of reflow-mounting the module to the printed wiring substrate without the limitation of sealing resin. Connection electrodes 12, 12 are formed on the component mounting surface 11 of the substrate 10 on wherein the electrode portions 21,21 of chip component 20 are mounted, the chip component 20 are connected and fixed by the solders 15,15. The chip component 20 is sealed by sealing resin (30). When the distance between the lower surface of the main body portion 22 of each of the chip components 20 and the component mounting surface 11 is assumed to be a and the thickness of the portion of the sealing resin which is disposed above the main body portion 22 is assumed to be b, if b/ais set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder 15, 15 which causes a short circuit between the two electrode portions.