This invention relates to a chip package unit and a method. The unit includes a chip and a hard cover, in which, the chip has an active surface and multiple weld pads matched to the surface, the cover is matched to the active surface to expose these weld pads above the active surface. The hard cover can protect the surface and increase the structure intensity of the chip package unit, besides, when the cover material is the heat conducting material of Cu or Al alloys, the cover can increase the heat radiation effect of the package unit, if the material is electric conductive, the cover connected to the earth can reduce outside EMI to the chip.