The invention discloses an eHSOP5L lead frame of a high-power driving circuit, a packaging member and a production method thereof. The lead frame is a multi-row matrix-type double-link single-island lead frame. The upper end of the island is provided with five inner pins with T-shaped heads and rectangular tails inner and connected to a lead frame body. The lower end of the island is provided withtwo cooling fins having the same width. A rectangular second stress relief groove is arranged between the two cooling fins. One end of each cooling fin is connected to the island, and a [pi]-shaped adhesive lock hole is disposed at the junction between the cooling fin and the island. Two double links are disposed on both sides of the island respectively. The double links are connected to the leadframe body. The lead frame of the present invention has a small thickness and a low price, is made of environmentally-friendly materials. A die-cutting production process uses a low-cost IC packagingmember and electroplates the lead frame with copper alloy, which is beneficial to environmental protection and the health of a user. The eHSOP5L lead frame is miniaturized and highly reliable, and has a short packaging cycle and low cost.