The invention relates to the technical field of manufacturing crystalline silicon solar cells, and provides a PERC double-sided solar cell wet etching process in order to solve the problem that the textured surface of an etched surface is not uniform after conventional wet etching, resulting in large color dispersion and low conversion efficiency of back SiN. The process comprises the following steps: (1) dripping water to form a water film; (2) primary etching; (3) pure water cleaning; (4) secondary etching; (5) pure water cleaning; (6) acid cleaning; (7) pure water cleaning; and (8) drying.The process performs the first etching and the re-etching on the back surface of a silicon wafer, not only removes PN junctions on the back surface and the edge of the silicon wafer and the porous silicon on the back surface of the silicon wafer, but also achieves uniform textured surface of the back surface of the silicon wafer, a high texturing rate, and good sunlight absorption, and finally improves the back conversion efficiency by 0.2% and the double-sided rate by 10%. The back textured surface is more uniform, so that the SiN color consistency after back coating is good, and the back color yield has an obvious effect of increasing from 97% to 99.5%.