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发明公开
CN108456508A 研磨微粒及其制造方法 无效 - 驳回

研磨微粒及其制造方法
摘要：
本发明提供了一种研磨微粒，该研磨微粒包括弹性芯体和包裹所述芯体的磨料层。该研磨微粒可以被用于制作在平坦化工艺中使用的研磨剂。本发明提供的研磨微粒，由于具有弹性芯体，因而在研磨芯片等半导体材料时，能够发生弹性形变，因而可以降低由于压力过大而划伤半导体材料表面的风险。此外，由于降低划伤半导体材料的风险功能主要由弹性芯体实现，所以本发明提供的研磨微粒在被用于研磨半导体材料时，还能够降低活性剂的消耗。
摘要（英）：

The invention provides a grinding microparticle, which comprises an elastic core body and a material grinding layer covering the core body. The grinding microparticle can be used for manufacturing a grinding agent used in the flattening process. The grinding microparticle provided by the invention has the elastic core body, so that during the grinding of semiconductor materials such as chips, theelastic deformation can occur, so that the risk of damaging the surface of the semiconductor materials through scratching due to too great pressure can be reduced. In addition, the function of reducing the risk of damaging the semiconductor materials through scratching is mainly realized by the elastic core body, so that the grinding microparticle provided by the invention can reduce the consumption of activating agents when being used for grinding the semiconductor materials.

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