Provided is a roughened copper foil with which both microcircuit formation (particularly circuit linearity) and close adhesion to resin can be achieved in processing of copper-clad laminates and manufacturing of printed wiring boards. This roughened copper foil has a roughened surface on at least one side, and for said roughened surface, Sa × Spd, which is the product of the arithmetic mean height Sa (µm) and the density of peaks Spd (peaks/mm2) that are measured according to ISO 25178, is at least 250000 µm/mm2, and the arithmetic mean waviness Wa measured according to JIS B0601-2001 is 0.030-0.060 µm.