Provided is a dicing sheet and a dicing/die-bonding film with which it is possible to eliminate sagging of the dicing sheet and to prevent contact between semiconductor elements. The present invention relates to a dicing sheet that contracts as a result of being heated for 1 minute at 100DEG C, with a second length in the MD direction after heating being 95% or less of 100% of a first length in the MD direction before heating. The dicing sheet is provided with a substrate, and a pressure-sensitive adhesive layer disposed on the substrate. The dicing/die-bonding film is provided with the dicing sheet, and an adhesive layer disposed on the pressure-sensitive adhesive layer.