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发明公开
CN106887415A 半导体封装系统和相关方法 有权

半导体封装系统和相关方法
摘要：
本发明提供了半导体封装的实施方式，所述实施方式可包括：衬底、耦接至所述衬底的壳体、以及多个压接插针。所述多个压接插针可与所述壳体固定地耦接。所述多个压接插针可具有至少一个锁定部分，所述锁定部分从所述多个压接插针的一侧延伸进入所述壳体中，并且所述多个压接插针可电耦接和机械耦接至所述衬底。
摘要（英）：

The invention provides a semiconductor package system and related methods. Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate, and a plurality of press-fit pins. The plurality of press-fit pins may be fixedly coupled with the case. The plurality of press-fit pins may have at least one locking portion that extends from a side of the plurality of press-fit pins into the case and the plurality of press-fit pins may be electrically and mechanically coupled to the substrate.

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