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发明公开
CN106449569A 叠层芯片微流道散热结构和制备方法 有权

叠层芯片微流道散热结构和制备方法
摘要：
本发明提供一种叠层芯片微流道散热结构，包括芯片基板、组装在芯片基板上的叠层芯片，所述叠层芯片被内封装材料所封装，形成内封装体；内封装体的侧面设有侧散热组件，顶部设有上散热组件；侧散热组件和上散热组件中均设有供冷却液流动的微流道；上散热组件与侧散热组件连接且上散热组件与侧散热组件中的微流道相连通；在内封装体两侧的芯片基板上设有穿透芯片基板的冷却液进口和冷却液出口；内封装体两侧侧散热组件中的微流道下端分别与冷却液进口和冷却液出口连通。本发明提高了叠层芯片的散热能力。
摘要（英）：

The invention provides a stacked-chip micro-channel heat dissipation structure. The structure comprises a chip substrate and stacked chips assembled on the chip substrate. The stacked chips are packaged by an inner packaging material to form an inner packaging body; the side face of the inner packaging body is provided with a side heat dissipation assembly, and the top of the inner packaging body is provided with an upper heat dissipation assembly; the side heat dissipation assembly and the upper heat dissipation assembly are each provided with a micro-channel used for cooling liquid flow; the upper heat dissipation assembly is communicated with the side heat dissipation assembly, and the micro-channel of the upper heat dissipation assembly is communicated with that of the side heat dissipation assembly; a cooling liquid inlet and a cooling liquid outlet are formed in the positions, on the two sides of the inner packaging body, of the chip substrate respectively and penetrate through the chip substrate; the lower ends of the sections, on the two sides of the inner packaging body, of the micro-channel in the side heat dissipation assembly are communicated with the cooling liquid inlet and the cooling liquid outlet respectively. The stacked-chip micro-channel heat dissipation structure improves the heat dissipation capacity of the stacked chips.

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