The invention discloses a die bonding method for an LED chip and an LED device. The method comprises the following steps of fabricating first metal bulges and a first adhesive layer which are alternately arranged on a back surface of a substrate of the LED chip; fabricating second metal bulges and a second adhesive layer which are alternately arranged on a surface of a base plate; attaching the back surface of the LED chip to the surface of the base plate so that the first metal bulges are correspondingly attached to the second metal bulges and the first adhesive layer are correspondingly attached to the second adhesive layer; and adopting a bonding technology to enable the first metal bulges and the second metal bulges to be bonded together and enable the first adhesive layer and the second adhesive layer to be bonded together, so that the LED chip is fixedly connected to the base plate and is electrically connected with the base plate. The LED device comprises the LED chip, the base plate and a die bonding layer, and the die bonding layer is clamped between the substrate of the LED chip and the surface of the base plate. By the adoption of the hybrid bonding technology of the metal bulges and the adhesive layers which are alternately distributed, the LED device has the advantages of good heat dissipation capability, and the interface thermal stress can be effectively relieved.