The invention discloses a large power LED structure adopting COB packaging and belongs to the technical field of optoelectronic devices. The large power LED structure includes a radiator, and a LED chip structure and a packaging layer which are arranged on the radiator. The radiator is characterized by electrical isolation. The large power LED structure, compared with current LED structures, removes an insulation layer, a metal substrate, and a heat conduction silica gel layer, shortens a heat transfer path, improves heat radiation performances, and reduces chip junction temperature. According to the invention, the packaging layer of the large power LED structure has an undulated surface of protrusions or/and indentations, which effectively increases the efficiency of light extraction. According to the invention, the radiator of the large power LED structure has a surface which is provided with grooves, which further shortens the heat radiation path and increases heat radiation performances. According to the invention, the large power LED structure has low manufacturing cost and simple structure, and is conducive to large scale mass production.