The invention discloses a wafer cleaning and drying apparatus. The wafer cleaning and drying apparatus comprises a turnplate, a first fluid disc and a second fluid disc, wherein the wafer is suitable for being fixed on the turnplate; the first fluid disc is arranged between the turnplate and the wafer; the second fluid disc and the first fluid disc are arranged in opposite relative to the wafer, wherein multiple spray orifices for spraying fluids are formed in the surfaces, facing to the wafer, of the first fluid disc and the second fluid disc; and the fluids comprise nitrogen. By adoption of the first fluid disc and the second fluid disc, the fluids in the first fluid disc can be sprayed to the lower surface of the wafer through the corresponding spray orifices, and the fluids in the second fluid disc can be sprayed to the upper surface of the wafer through the corresponding spray orifices so as to effectively clean the wafer; when the fluid sprayed from the first fluid disc and the second fluid disc is nitrogen, the upper surface and the lower surface of the wafer can be effectively dried; and residual water mark on the upper surface and the lower surface of the wafer can be effectively removed by nitrogen.