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发明公开
CN104979317A 半导体器件及其制造方法 无效 - 撤回

半导体器件及其制造方法
摘要：
本发明提供一种半导体器件及其制造方法，能够提高半导体器件的可靠性。实施方式中的特征点在于：在焊盘(PD)与引出布线部(DWU)的连接部位设置有倾斜部(SLP)。由此，能够抑制在通过表面保护膜(PAS)将焊盘(PD)的一部分覆盖的覆盖区域产生裂纹。
摘要（英）：

The invention provides a semiconductor device and a method of manufacturing the same capable of improving the reliability of the semiconductor device. The semiconductor device is characterized by its embodiments in that sloped portions (SLP) are formed on connection parts between a pad (PD) and a lead-out wiring portion (DWU), respectively. This feature suppresses crack formation in a coating area where a part of the pad is covered with a surface protective film.

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