The invention aims to effectively and reliably manufacture a laminated plate which can maintain mechanical strength and which is excellent in conductor layer seal strength. The manufacturing method for the laminated plate includes a step (A) and a step (B). The step (A) is a step of preparing bonding pieces. The bonding pieces are thermal set resin composition layers which are as thick as 1 [mu]m to 10 [mu]m and with a pencil harness of more than 2B. The thermal set resin composition layers are arranged on an organic support body. The step (B) is that more than one prepreg is configured to be between two boding pieces in a mode thermal set resin compositions are configured to be in contraposition, then in a condition of reduced pressure, heating and pressing are carried out at more than 200 DEG C to enable integral moulding.