The invention provides a COB type LED packing piece based on beryllium oxide ceramic substrate and production method, and the packing piece comprises a substrate made of the beryllium oxide ceramic board, a box dam and two symmetrical electrodes are formed on the substrate; a plurality of series circuits not crossed to each other and composed of light-emitting diode are formed in the substrate solid crystal region, two ends of each series circuit are respectively connected to two electrodes, the fluorescent powder glue is fixedly sealed in the box dam. The COB type LED packing piece based on beryllium oxide ceramic substrate is prepared by the steps as follows: cleaning beryllium oxide ceramic board, screen-printing the electrode, high temperature sintering, manufacturing the box dam, baking and dehumidifying, plasma cleaning, pasting LED chip, baking, bonding, baking, coating fluorescent powder glue in the box dam and solidifying, blanking, spectral testing, packaging and putting in storage. The beryllium oxide substrate is applied to the LED in the LED packing piece with good heat radiation capability, the high power LED packing product is small in volume, light in weight and high in reliability.