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发明公开
CN104271694A 带粘接性树脂层的片和半导体装置的制造方法 有权

带粘接性树脂层的片和半导体装置的制造方法
摘要：
提供一种在保持了芯片状部件的整齐性（整列性）的情况下能够转印芯片状部件的带粘接性树脂层的片。另外，提供一种使用了该片的半导体装置的制造方法。本发明的带粘接性树脂层的片包含基材和层叠在该基材上的粘接性树脂层，以70℃加热1分钟后的基材的MD方向和CD方向的收缩率为-0.5~0.5%，基材的硬挺度为80mm以上。
摘要（英）：

To provide: a sheet having an adhesive resin layer attached thereto, which enables the transfer of chip-like components while keeping the chip-like components in a nicely arranged state; and a method for producing a semiconductor device using the sheet. The sheet having an adhesive resin layer attached thereto according to the present invention comprises a base and an adhesive resin layer laminated on the base, wherein the rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70DEG C for 1 minute is -0.5 to 0.5% and the bending resistance of the base is 80 mm or more.

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