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发明公开
CN103579097A 形成互连结构的方法及互连结构 无效 - 撤回

形成互连结构的方法及互连结构
摘要：
本发明涉及形成互连结构的方法及互连结构。在存在于衬底表面上的含铜结构的暴露的侧壁表面和最上表面上形成连续的石墨烯层。在含铜结构上所述连续的石墨烯层的存在减少了铜氧化和铜离子的表面扩散，因此提高了所述结构的抗电迁移性。使用石墨烯可以获得这些优点而不增加含铜结构的电阻。
摘要（英）：

The invention provides a method for forming an interconnect structures and the interconnect structure. A contiguous layer of graphene is formed on exposed sidewall surfaces and a topmost surface of a copper-containing structure that is present on a surface of a substrate. The presence of the contiguous layer of graphene on the copper-containing structure reduces copper oxidation and surface diffusion of copper ions and thus improves the electromigration resistance of the structure. These benefits can be obtained using graphene without increasing the resistance of copper-containing structure.

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