The invention relates to a heat-resistance pressure-sensitive adhesive tape for semiconductor device production and a method for producing a semiconductor device by using the heat-resistance pressure-sensitive adhesive tape. The heat-resistance pressure-sensitive adhesive tape for the semiconductor device production comprises a base material layer and pressure-sensitive adhesive layers formed on various sides of the substrate layer, wherein the pressure-sensitive adhesive layer on at least one side, which is to be wrapped by resin, of a semiconductor chip comprises a silicone pressure-sensitive adhesive. The heat-resistance pressure-sensitive adhesive tape is used for temporarily fixing the chip in the method for producing a substrate-free semiconductor package body without a metal lead frame.