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CN103081096A 半导体装置及半导体装置的生产方法 无效 - 撤回

半导体装置及半导体装置的生产方法
摘要：
半导体装置具有：平板状的电导通部，其在垂直上部配置并电连接有半导体元件；壳体，其在设于内壁下部的结合部结合该电导通部的周缘部，并且内壁上部包围电导通部的全周；密封材料，其从垂直上方覆盖半导体元件及电导通部。一体成形电导通部和壳体，作为结合部，在壳体的内壁下部设有与电导通部的周缘部结合的形状的空间。
摘要（英）：

A semiconductor device has: a flat-shaped conductive portion on which a semiconductor element is disposed in a vertically superior portion and electrically connected; a casing wherein an edge portion of the conductive portion is engaged with an engaging portion provided on a lower portion of an inner wall, and wherein an upper portion of the inner wall surrounds the entire perimeter of the conductive portion; and a sealing material that covers the semiconductor element and the conductive portion from a vertically superior direction. The conductive portion and the casing are integrally formed, and a space shaped so as to engage with the edge portion of the conductive portion is provided on the lower portion of the inner wall of the casing as the engaging portion.

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