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发明公开
CN102822112A 金属基基板及其制造方法 失效 - 权利终止

金属基基板及其制造方法
摘要：
在由铜形成的金属板上形成有低温烧结陶瓷层的金属基基板中，提高金属板和低温烧结陶瓷层的接合可靠性。通过在由铜形成的金属板（14）的表面上层叠包含含有换算成BaO为10～40摩尔％的钡和换算成SiO2为40～80摩尔％的硅的低温烧结材料的低温烧结陶瓷生坯层，从而制作生的层叠体，在低温烧结陶瓷生坯层烧结的温度下对该生的层叠体进行烧成。在这样得到的金属基基板（12）中的金属板（14）和低温烧结陶瓷层（15）之间形成由Cu-Ba-Si系玻璃形成的厚1～5μm的玻璃层（22）。该玻璃层（22）显示良好的接合可靠性。
摘要（英）：

Disclosed is a manufacturing method of a metal base substrate which increases the reliability of bonding between a metal substrate and a low-temperature sintering ceramic layer in the metal base substrate in which a low-temperature sintering ceramic layer is formed on a metal substrate which is configured from copper. An unsintered laminate is produced by stacking on the surface of the cupreous metal substrate (14) low-temperature sintering ceramic green layers containing a low-temperature sintering ceramic material containing barium at 10-40 %mol in terms of BaO, and silicon at 40-80 %mol in terms of SiO2. This unsintered laminate is sintered at a temperature at which the low-temperature sintering ceramic green layers are sintered. A 1-5[mu]m thick glass layer (22) comprising a Cu-Ba-Si-based glass is formed between the metal substrate (14) and the low-temperature sintering ceramic layers (15) on the metal base substrate (12) obtained in this way. This glass layer (22) has excellent bonding reliability.

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