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发明授权
CN102623373B 切断用加工方法 有权

切断用加工方法
摘要：
一种切断用加工方法，沿着切断预定线可靠地将加工对象物切断。通过向加工对象物(1)对准聚光点并照射激光，以沿着切断预定线(5)在加工对象物(1)中形成改质区域(M1)。对该形成有改质区域(M1)的加工对象物1，通过利用对改质区域的蚀刻速率比对非改质区域的蚀刻速率高的蚀刻液施以蚀刻处理，来蚀刻改质区域(M1)。因此，利用对改质区域(M1)的高蚀刻速率，沿着切断预定线(5)有选择且迅速地蚀刻加工对象物(1)。
摘要（英）：

An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region.

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