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发明公开
CN102468120A 激光加工装置以及利用该装置的激光加工方法 无效 - 撤回

激光加工装置以及利用该装置的激光加工方法
摘要：
本发明涉及一种利用激光加工材料的激光加工装置以及利用该装置的激光加工方法，更详细地说，公开了能够缩短工序时间、提高生产率的激光加工装置以及利用该装置的激光加工方法。该激光加工方法包括如下步骤：引出晶片步骤，所述送料机从安装在所述晶片盒升降器上的晶片盒中引出晶片并移送至所述晶片对准器；晶片排列及边缘检测步骤，所述晶片对准器对所述晶片的两侧面施压而排列晶片，然后所述边缘检测器动作而检测被固定在所述晶片对准器上的晶片的外轮廓形状图案；装载晶片步骤，所述转送臂动作，将已结束边缘检测的晶片移送至工作台；以及加工晶片步骤，所述工作台和所述激光加工部动作，加工晶片。
摘要（英）：

The invention relates to a laser processing device utilizing laser processing material, and a laser processing method using the same. More specific, disclosed is the laser processing device and the laser processing method using the same, which helps to shorten the processing time and improve the production efficiency. The laser processing method includes the steps of guiding a wafer, wherein the wafer is guided by a feeder from a wafer box arranged on a lifting device on the wafer box and is conveyed to a wafer aligner; arranging the wafer and detecting the edge of the wafer, wherein the two sides of the wafer are pressed by the wafer aligner for wafer arrangement, and an edge detector acts to detect the outline shape pattern of the wafer fixed on the wafer aligner; loading the wafer, wherein a conveying arm runs to convey the wafer, the edge of which has been detected, to a workbench; and processing the wafer, wherein the workbench and a laser processing portion are operated for processing the wafer.

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