知搜-全球专利检索

  1. 登录
  2. 注册
发明公开
CN102371434A 激光加工方法以及激光加工装置 无效 - 撤回

激光加工方法以及激光加工装置
摘要：
本发明涉及一种使用激光来加工部件的激光加工装置以及利用该激光加工装置的激光加工方法，特别涉及一种将晶片加载到工作台上之后的加工方法以及用于该方法的激光加工装置。本发明提供一种激光加工方法，该激光加工方法包括：加载晶片步骤，将晶片加载到工作台上；检测步骤，移动上述工作台并掌握形成在所加载的晶片上的芯片数量，检测缺陷并排列晶片；测量高度步骤，利用位移传感器检测加载到上述工作台上的晶片表面高度；检测激光功率步骤，利用功率表检测加工用激光的功率；以及激光加工步骤，照射上述加工用激光并移动上述工作台，以此加工晶片。
摘要（英）：

The present disclosure relates to a laser processing apparatus for processing materials using laser and a laser processing method adopting the laser processing apparatus. Processing method performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing method includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

0/0