知搜-全球专利检索

  1. 登录
  2. 注册
发明公开
CN102254789A 剥离方法及剥离液 有权

剥离方法及剥离液
摘要：
本发明提供一种在短时间内容易地从基板上剥离支承板的剥离方法，其为将利用粘接剂粘贴于设有在厚度方向贯通的贯通孔的支承板的基板从该支承板剥离的方法，其中，包括有经由贯通孔使剥离液与粘接剂接触来溶解粘接剂的工序，粘接剂为以烃树脂为粘着成分的粘接剂，剥离液为粘度为1.3mPa·s以下、且对粘接剂的溶解速度为30nm/sec以上的烃系溶剂。
摘要（英）：

A method for stripping a wafer from a supporting plate to which the wafer is adhered via an adhesive agent, wherein the supporting plate has a through hole penetrating the supporting plate in a thickness direction thereof, the method Including dissolving the adhesive agent with a stripping solution by contacting the stripping solution with the adhesive agent via the through hole. The adhesive agent has a hydrocarbon resin as a viscous component, and the stripping solution is a hydrocarbon-based solvent having a viscosity of 1.3 mPas or less and a dissolving rate of 30 nm/sec or greater to dissolve the adhesive agent.

公开/授权文献
0/0