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发明授权
CN102244018B 芯片埋入式印刷电路板的制造方法 有权 转让

芯片埋入式印刷电路板的制造方法
摘要：
本发明适用于印刷电路板领域，提供了一种芯片埋入式印刷电路板的制造方法，首先在晶圆上形成0.3～0.5微米的第一金属电极(即金属焊盘)，然后在第一金属电极上电镀出60～100微米高度的第二金属电极(一般为铜电极)，接下来将芯片嵌入芯板的插孔内，通过芯片上的第二金属电极实现芯片与印刷电路板外层电路的电连接，而不需要通过激光加工盲孔并电镀盲孔形成导电中介来实现与印刷电路板外部电路的连接，因此本发明突破了激光加工盲孔和电镀盲孔加工能力的局限，可显著降低埋入式电路板的制造成本。
摘要（英）：

The invention is applicable to the field of printed circuit boards and provides a manufacturing method of a chip embedded type printed circuit board. The manufacturing method comprises the following steps of: firstly, forming a first metal electrode (namely a metal welding disk) with a height of 0.3 to 0.5 microns on a wafer; secondly, electroplating a second metal electrode (generally a copper electrode) with a height of 60 to 100 microns on the first metal electrode; and finally, embedding a chip into an insertion hole of a core plate, wherein electric connection between the chip and an outer circuit of the printed circuit board is realized through the second metal electrode on the chip instead of a conductive medium formed by laser-processing and electroplating a blind hole; therefore,the limit of the blind hole laser-processing and electroplating capability is broken through and the manufacturing cost of the embedded type circuit board is reduced obviously.

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