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发明公开
CN102211260A 一种陶瓷相增强的铜基复合钎料及其制备方法 无效 - 撤回

一种陶瓷相增强的铜基复合钎料及其制备方法
摘要：
一种陶瓷相增强的铜基复合钎料及其制备方法，涉及一种铜基复合钎料及其制备方法。本发明是要解决现有陶瓷连接方法中Ag-Cu-Ti钎料成本高，残余应力造成接头强度低的问题。陶瓷相增强的铜基复合钎料包含Cu粉、Sn粉、Ti粉和B粉。方法：将Cu粉、Sn粉、Ti粉和B粉混合，得到混合粉末；将混合粉末和陶瓷球加入行星式球磨机的球磨罐中，以300r/min的速度，在氩气气氛保护下进行球磨处理，球磨处理1～5h，即得到混合均匀的Cu-Sn-Ti-B复合钎料。本发明在降低钎焊成本的同时，通过在接头中原位自生TiB晶须调节了金属与陶瓷间的热失配，从而提高了钎焊接头使用性能。应用于陶瓷的钎焊链接。
摘要（英）：

The invention discloses a ceramic phase reinforced copper-based composite solder and a preparation method thereof, relates to a copper-based composite solder and a preparation method thereof, and aims to solve the problems that an Ag-Cu-Ti solder has high cost, and low joint strength caused by residual stress in the conventional ceramic connection method. The ceramic phase reinforced copper-based composite solder comprises Cu powder, Sn powder, Ti powder and B powder. The method comprises the following steps of: mixing the Cu powder, the Sn powder, the Ti powder and the B powder to obtain mixed powder; and adding the mixed powder and ceramic balls into a ball-milling tank of a planetary ball mill, and performing ball milling for 1 to 5 hours at a rate of 300r/min under the protection of argon gas to obtain a uniformly mixed Cu-Sn-Ti-B composite solder. Soldering cost is reduced, and thermal mismatching between metal and ceramic is adjusted by growing TiB crystal whiskers in a joint in situ, so that the usability of the soldered joint is improved. The solder is applied to the soldering connection of the ceramic.

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