The invention relates to a method for depositing a photoresist on a microelectronic or photoelectronic chip. The method comprises the following steps of: firstly selecting a substrate (1) with the same thickness with a chip (4), depositing a hard mask layer (2) and a photoresist (3) on the substrate (1), and photoetching a graph which is provided with an opening in the center while the chip (4) is taken as a mask; corroding to form a first through hole (6), and carrying out deep etching to obtain a second through hole (7); then removing the photoresist (3) and the hard mask layer (2) to obtain a photoresist spinning sheath (8); and then placing the chip (4) in the second through hole (7) of the photoresist spinning sheath (8), fixing the chip (4) on a support film (9) by utilizing the photoresist spinning sheath (8), and fixing the support film (9) on the photoresist spinning machine; and dropping a photoresist (10) onto the surface of the chip (4) for realizing photoresist spinning, thus the photoresist (11) with uniform thickness is obtained on the surface of the chip. By adopting the technology, the thickness of the photoresist edge can be effectively reduced, the utilization factor of the area of the chip can be improved, and the completeness of a follow-up process is increased.