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发明公开
CN102130235A 一种LED芯片的封装方法及封装器件 失效 - 权利终止 转让

一种LED芯片的封装方法及封装器件
摘要：
本发明公开一种LED芯片的封装方法及封装器件，该方法包括在基板上生长围绕透镜成型区域的凸起，将LED芯片安装在所述基板上，所述LED芯片位于由所述凸起界定的透镜成型区域中，将设定剂量的流体状封装材料注入到所述LED芯片顶部，并经固化形成封装所述LED芯片的透镜。本发明通过以上技术方案，提供一种无需借助额外的模具便可实现封装，并能够适应LED晶圆级封装的LED芯片的封装方法及封装器件。
摘要（英）：

The invention discloses a method and a device for packaging a light emitting diode (LED) chip. The method comprises the following steps of: growing lug bosses surrounding a lens molding area on a substrate, and arranging the LED chip on the substrate, wherein the LED chip is positioned in the lens molding area defined by the lug bosses; and injecting a fluidic packaging material in a set dose into the top of the LED chip, and curing to form a lens for packaging the LED chip. Due to the technical scheme, the invention provides a method and a device for packaging the LED chip which can realize the packaging without an extra mold and adapt to LED wafer-level packaging.

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