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发明授权
CN102097311B 一种平坦化方法 有权

一种平坦化方法
摘要：
本发明涉及一种平坦化方法，其包括如下步骤：a、提供衬底，衬底上设置底层金属连线；b、淀积绝缘介质层；c、涂布光刻胶；d、对衬底及光刻胶进行热处理；e、对衬底及光刻胶进行干法刻蚀，并保留位于金属连线底层台阶处的绝缘介质层；f、用EKC溶液清洗；g、再次淀积绝缘介质层；h、再次涂布光刻胶；i、对上述衬底及光刻胶进行热处理；j、对上述衬底及光刻胶进行干法刻蚀，去除绝缘介质层及所述绝缘介质层上的光刻胶，并保留位于金属连线底层台阶处的绝缘介质层；所述保留的绝缘介质层的厚度与所述底层金属连线的厚度相当；k、对上述衬底通过干法去胶后，再用EKC溶液清洗。本发明工艺步骤简单有效，加工成本低廉，平坦化效果好，安全可靠。
摘要（英）：

The invention relates to a planarization method comprising the following steps: a. providing a substrate provided with a bottom metal wire; b. depositing an insulating dielectric layer; c. coating photoresist; d. carrying out heat treatment on the substrate and the photoresist; e. carrying out dry etching on the substrate and the photoresist and retaining the insulating dielectric layer on the bottom step of the metal wire; f. carrying out cleaning with EKC solution; g. depositing the insulating dielectric layer again; h. coating photoresist again; i. carrying out heat treatment on the substrate and the photoresist; j. carrying out dry etching on the substrate and the photoresist, removing the insulating dielectric layer and the photoresist on the insulating dielectric layer and retainingthe insulating dielectric layer on the bottom step of the metal wire; and k. after removing the photoresist from the substrate by a dry method, carrying out cleaning with EKC solution, wherein the thickness of the retained insulating dielectric layer is equivalent to that of the bottom metal wire. The method has the advantages of simple and effective process steps, low processing cost, good planarization effect, safety and reliability.

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