Multi-layer ceramic capacitor
    1.
    发明授权

    公开(公告)号:US11715593B2

    公开(公告)日:2023-08-01

    申请号:US17145688

    申请日:2021-01-11

    摘要: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 μm or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.

    Multi-Layer Ceramic Capacitor
    2.
    发明申请

    公开(公告)号:US20180294097A1

    公开(公告)日:2018-10-11

    申请号:US15918372

    申请日:2018-03-12

    IPC分类号: H01G2/20 H01G4/30 H01G4/008

    摘要: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, internal electrodes disposed between the ceramic layers, a main surface oriented in the first direction, a surface layer portion in a range from the main surface to a predetermined depth, and a center portion adjacent to the surface layer portion in the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The ceramic layers have an average dimension in the first direction that is 0.4 μm or less. Each of the internal electrodes includes an oxidized region adjacent to the side margin. The oxidized region in the surface layer portion has a dimension in the second direction that is equal to or more than two times the average dimension of the ceramic layers in the first direction.

    CAPACITOR ASSEMBLY AND ASSOCIATED METHOD
    3.
    发明申请
    CAPACITOR ASSEMBLY AND ASSOCIATED METHOD 审中-公开
    电容器组装及相关方法

    公开(公告)号:US20150213951A1

    公开(公告)日:2015-07-30

    申请号:US14685094

    申请日:2015-04-13

    申请人: Medtronic, Inc.

    发明人: Rajesh V. Iyer

    IPC分类号: H01G2/20 A61N1/375 H01G4/35

    摘要: A capacitor assembly for use in, and a method of assembling, a filtered feedthrough. The capacitor includes an insulative member fixedly attached to its bottom portion to inhibit high voltage arcing. The termination material present on the inner and outer diameters of the capacitor is absent from a portion of the capacitor proximate the bottom portion, e.g., at the insulative member.

    摘要翻译: 一种电容器组件,用于组装滤波后的馈通。 电容器包括固定地附接到其底部的绝缘构件,以抑制高电压电弧。 存在于电容器的内径和外径上的端接材料不存在靠近底部的电容器的一部分,例如在绝缘构件上。

    Ceramic electronic component and method for manufacturing the same
    4.
    发明授权
    Ceramic electronic component and method for manufacturing the same 有权
    陶瓷电子元件及其制造方法

    公开(公告)号:US07570477B2

    公开(公告)日:2009-08-04

    申请号:US12261144

    申请日:2008-10-30

    申请人: Takayuki Kayatani

    发明人: Takayuki Kayatani

    摘要: In a ceramic electronic component, an electrically conductive resin layer is arranged to cover a thick film layer and to extend beyond the end of the thick film layer by at least about 100 μm and a plating layer is arranged to cover the electrically conductive resin layer except a region having a dimension of at least about 50 μm and extending along the end of the electrically conductive resin layer. Consequently, the concentration of the stress is reduced.

    摘要翻译: 在陶瓷电子部件中,导电性树脂层被设置为覆盖厚膜层并且延伸超过厚膜层的端部至少约100μm,并且布置覆盖导电树脂层的镀层,除了 具有至少约50μm的尺寸并且沿着导电树脂层的端部延伸的区域。 因此,应力的浓度降低。

    Method of forming external electrode
    5.
    发明授权
    Method of forming external electrode 有权
    形成外部电极的方法

    公开(公告)号:US07458151B2

    公开(公告)日:2008-12-02

    申请号:US11288203

    申请日:2005-11-29

    IPC分类号: H01R43/00 H05K3/30 H01G2/20

    摘要: The object of the invention is to provide a method of forming an external electrode of an electronic component whereby the external electrode can be formed in a stable fashion. In order to achieve this object, a method of forming an external electrode according to the present invention includes: a step of forming an electrode portion 301a on a side face 30a of a chip 30 constituting an electronic component by applying a conductive paste 20 from a direction facing this side face 30a; a step of forming an electrode portion 301b on a side face 30b of the chip 30 facing the side face 30a by applying the conductive paste 20 from a direction facing this side face 30b; a step of forming an electrode portion 301c so as to connect the electrode portion 301a and electrode portion 301b on the bottom face of the chip 30 respectively adjacent to the side face 30a and the side face 30b; and a step of forming an external electrode 301 comprising the electrode portion 301a, electrode portion 301b and electrode portion 301c by drying this chip 30.

    摘要翻译: 本发明的目的是提供一种形成电子部件的外部电极的方法,由此能够以稳定的方式形成外部电极。 为了实现该目的,根据本发明的形成外部电极的方法包括:通过从导电膏20涂覆构成电子部件的芯片30的侧面30a上形成电极部分301a的步骤 朝向该侧面30a的方向; 通过从面向该侧面30b的方向施加导电膏20,在面向侧面30a的芯片30的侧面30b上形成电极部分301b的步骤; 形成电极部分301c以将电极部分301a和分别邻近侧面30a和侧面30b的芯片30的底面上的电极部分301b连接的步骤; 以及通过干燥该芯片30形成包括电极部分301a,电极部分301b和电极部分301c的外部电极301的步骤。

    SURFACE-MOUNTING CERAMIC ELECTRONIC COMPONENT
    6.
    发明申请
    SURFACE-MOUNTING CERAMIC ELECTRONIC COMPONENT 审中-公开
    表面安装陶瓷电子元件

    公开(公告)号:US20070242416A1

    公开(公告)日:2007-10-18

    申请号:US11696067

    申请日:2007-04-03

    IPC分类号: H01G4/06 H01G2/20 C04B35/64

    摘要: One inventive aspect relates to a surface-mounting ceramic electronic component including a terminal electrode structure which improves the mechanical strength of the electronic component. In the terminal electrode structure, an intermediate metal layer is formed on a base metal layer, and a conductive resin layer is formed thereon. A surface of the base metal layer in which a common material, an oxide film, glass frit or the like exists is covered with the intermediate metal layer, and the conductive resin layer is adhered to the intermediate metal layer as a tight metal surface.

    摘要翻译: 一个发明方面涉及一种表面安装陶瓷电子部件,其包括提高电子部件的机械强度的端子电极结构。 在端子电极结构中,在基底金属层上形成中间金属层,在其上形成导电性树脂层。 其中存在普通材料,氧化膜,玻璃料等的基底金属层的表面被中间金属层覆盖,并且导电树脂层作为紧密的金属表面粘附到中间金属层。

    Capacitor method and apparatus
    7.
    发明授权
    Capacitor method and apparatus 失效
    电容器方法和装置

    公开(公告)号:US06924970B2

    公开(公告)日:2005-08-02

    申请号:US10335144

    申请日:2002-12-30

    CPC分类号: H01G4/30 H01G4/232

    摘要: A method and apparatus is provided that pertains to a low inductance capacitor. The capacitor has a first surface electrically interconnected to a plurality of conductive electrodes and one or more second surfaces electrically interconnected to a plurality of electrodes interposed between the electrodes electrically interconnected to the first conductive surface. A dielectric layer separates the layered plurality of electrodes. The one or more second conductive surfaces are positioned within the body of the layered electrodes, such that the distance between the terminations of the first conductive surface and the one or more second conductive surfaces is shortened to lower inductance.

    摘要翻译: 提供一种涉及低电感电容器的方法和装置。 电容器具有电互连到多个导电电极的第一表面和与互连到第一导电表面的电极之间的多个电极电互连的一个或多个第二表面。 电介质层分离多层电极。 一个或多个第二导电表面位于层状电极的主体内,使得第一导电表面的端子与一个或多个第二导电表面之间的距离被缩短以降低电感。

    Capacitor mounting structure
    8.
    发明授权
    Capacitor mounting structure 有权
    电容器安装结构

    公开(公告)号:US06885538B1

    公开(公告)日:2005-04-26

    申请号:US10938824

    申请日:2004-09-13

    摘要: A capacitor mounting structure is proposed which can easily relieve a stress given to an extraction lead when ambient temperature is changed, soldering is made, or vibration is given, and can prevent breakage of the extraction lead. An outside holder is provided at an outside of a resin case housing a capacitor covered with a filler, and an inside holder is provided. The outside holder includes an upper outer wall bonded to an upper resin wall of the resin case. Lower openings of the resin case and the outside holder overlap with each other and form a lower space. An extraction lead is disposed in the lower space.

    摘要翻译: 提出了一种电容器安装结构,其可以在环境温度变化,焊接或振动给定时容易地减轻施加到引出线的应力,并且可以防止引出线的断裂。 外部保持器设置在容纳覆盖有填充物的电容器的树脂壳体的外侧,并且设置有内侧保持器。 外部保持器包括结合到树脂壳体的上部树脂壁的上部外壁。 树脂外壳和外保持架的下开口彼此重叠并形成较小的空间。 提取引线设置在下部空间中。

    Capacitor device
    9.
    发明授权
    Capacitor device 失效
    电容器

    公开(公告)号:US5771149A

    公开(公告)日:1998-06-23

    申请号:US807860

    申请日:1997-02-26

    CPC分类号: H01G4/224

    摘要: A fixing part having a room in which a metal attachment leg is inserted to attach a capacitor unit is disposed on an outside face of a case. An electrode connected to a terminal of a capacitor element is disposed in the fixing part, and a lock part to be engaged with the inserted metal attachment leg is disposed, whereby when the metal attachment leg is inserted into the fixing part, the electrode of the fixing part is electrically contacted to the metal attachment leg by elasticity.

    摘要翻译: 在壳体的外表面上设置有具有插入金属附件脚以安装电容器单元的房间的固定部。 连接到电容器元件的端子的电极设置在固定部分中,并且设置与插入的金属附接腿接合的锁定部分,由此当金属附接腿插入固定部分时, 固定部分通过弹性与金属附接腿电接触。

    Metallized film capacitor process
    10.
    发明授权
    Metallized film capacitor process 失效
    金属化薄膜电容器工艺

    公开(公告)号:US5019418A

    公开(公告)日:1991-05-28

    申请号:US198605

    申请日:1988-05-09

    摘要: A self-healing metallized film capacitor has a dielectric sheet metallized with a metal or alloy so chosen to provide the desired sheet resistivity for a given metallization thickness. The invention applies to any metallized film capacitor in which electrode metallization thickness and clearability are important considerations.

    摘要翻译: 自修复金属化薄膜电容器具有金属化的金属或合金的电介质片,以便为给定的金属化厚度提供所需的薄层电阻率。 本发明适用于其中电极金属化厚度和可清除性是重要考虑因素的任何金属化薄膜电容器。