WATERBORNE ALUMINUM FORMULATION AND METHOD OF PREPARING THE SAME

    公开(公告)号:US20250034410A1

    公开(公告)日:2025-01-30

    申请号:US18713567

    申请日:2022-11-24

    Abstract: Disclosed is a waterborne aluminum formulation, comprising aluminum powder, a passivation agent, and an acrylic resin. The invention also discloses a method of preparing a waterborne aluminum formulation comprising: (1) with high-speed stirring, adding a passivation agent, optionally an organic solvent, and optionally other additives, followed by adding aluminum powder to form a first premix: (2) sequentially adding an acrylic resin and water, followed by adding optionally other additives to form a second premix; and (3) with high-speed stirring, adding the second premix into the first premix. The invention further discloses a coating composition comprising the above waterborne aluminum formulation or the waterborne aluminum formulation prepared by the above method.

    DEVELOPMENT OF NOVEL NEUTRAL LAYER AND HYDROPHOBIC PINNING MAT MATERIALS FOR USE IN DSA WITH IMPROVED SUBSTRATE COMPATIBILITY

    公开(公告)号:US20250034306A1

    公开(公告)日:2025-01-30

    申请号:US18711795

    申请日:2022-11-30

    Abstract: The invention relates to a random copolymer of structure (A) comprising, a carboxylic acid bearing repeat of structure (I), a 4-vinylbenzocyclobutene derived repeat unit of structure of structure (II), a styrenic repeat unit of structure (III), an alkyl acrylate or alkyl 2-methylenealkanoate derived repeat unit of structure (IV), a hydroxy functionalized alkyl acrylate or alkyl 2-methylenealkanoate derived repeat unit of structure (V), and two end groups as shown in structure (A) one of which is H and the other is a methyl moiety substituted with Rr, Rr1 and Rr2, wherein Rr1, is a C-1 to C-8 alkyl, Rr2 is selected from a C-1 to C-8 alkyl, a C-1 to C-8 alkylene hydroxy moiety (-alkylene-OH), a C-1-C-8 alkylenecarboxylic acid moiety (-alkylenne-CO2H), or a benzylic alcohol comprising moiety of structure (B), Rr is a cyano moiety (—CN) or a carbonylalkyl moiety (—C(═O)—Ri), wherein Ri is a C-1 to C-8 alkyl or an aryl moiety.

    WATER-BASED THERMAL-INSULATION COATING MATERIAL

    公开(公告)号:US20250011601A1

    公开(公告)日:2025-01-09

    申请号:US18469510

    申请日:2023-09-18

    Abstract: A water-based thermal-insulation coating material includes a water-based resin, a film forming auxiliary agent, and a thermal insulation agent. The water-based resin is at least one material selected from a group consisting of: acrylic resins, polyurethane resins, epoxy resins, and combinations thereof. The water-based resin has a minimum film-forming temperature of not less than 5° C. The film forming auxiliary agent is at least one material selected from a group consisting of: plasticizers, alcohol-ether solvents, alcohol-ester solvents, a mixed solvent of ethylene glycol mono-butyl ether and di-propylene glycol butyl ether, aprotic solvents, and combinations thereof. The thermal insulation agent is hydrated silicon dioxide.

    HIGH ENERGY RAY-CURABLE COMPOSITION AND USE OF SAME

    公开(公告)号:US20240409750A1

    公开(公告)日:2024-12-12

    申请号:US18690404

    申请日:2022-08-31

    Abstract: Provided is a high energy ray-curable composition containing silicon atoms, in which the cured product has high transparency and low dielectric properties, and has low viscosity and excellent workability when applied to a substrate even when the composition is solvent free. The high energy ray-curable composition comprises: (A) 5 parts by mass to 95 parts by mass of a compound having one or more (meth)acryloxy groups and no silicon atoms in the molecule; and (B) 95 parts by mass to 5 parts by mass of a branched organopolysiloxane having one (meth)acryloxy group and no alkoxy group in a molecule, some of the oxygen atoms being substitutable with a divalent alkylene group having no more than 6 carbon atoms. The high energy ray-curable composition contains substantially no organic solvent and the viscosity of the entire composition (measured at 25° C. using an E-type viscometer) is 500 mPa's or less.

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