公开(公告)号：US11857558B2

公开(公告)日：2024-01-02

申请号：US16568834

申请日：2019-09-12

申请人： ANGELUS INDÚSTRIA DE PRODUTOS ODONTOLÓGICOS S/A

发明人： César Eduardo Bellinati ,  Cristiane Vila ,  William Pereira Dos Santos ,  Maíra Bendlin Calzavara

IPC分类号： A61K31/695 ,  A61K6/76 ,  C08F30/08

CPC分类号： A61K31/695 ,  A61K6/76 ,  C08F30/08 ,  A61K2800/412 ,  A61K2800/623

摘要： This disclosure provides bioceramic compositions of multiparticulate crystalline multimetallic silicates having silica double tetrahedra structures, such as Strontium-akermanite (Sr2MgSi2O7), Akermanite (Ca2MgSi2O7), Baghdadite (Ca3ZrSi2O9), Hardystonite (Ca2ZnSi2O7), as sources for controlled release of multiple metallic ions, such as Ca2+, Mg2+, Zr4+, Sr2+, Zn2+ for medical and dental use. This disclosure also includes medical and dental uses of the disclosed compositions, for example, in tissue regeneration, including bone tissue.

公开(公告)号：US20220290005A1

公开(公告)日：2022-09-15

申请号：US17824528

申请日：2022-05-25

申请人： Cowper Sciences Inc.

发明人： Gaurav SAINI ,  David SMITH ,  Patrick WALSH ,  Jae H. PARK

IPC分类号： C09D183/08 ,  B05D1/00 ,  C07F7/08 ,  C08F30/08 ,  C08G77/26 ,  C09D143/04 ,  G01N33/543 ,  C08G65/336 ,  C07F7/18

摘要： Molecules or salts thereof are provided, having the structure in Formula I,
wherein n2 and n4 are the same or different and are independently 1, 2, or 3, and n3 is 1 to 20; X is oxygen, nitrogen, or sulfur; wherein R1, R2, R3, R4, R5, R6, and R7 are as described herein. Methods are also provided for the synthesis of and use of the provided molecules in applications for diagnostic testing.

公开(公告)号：US20220252981A1

公开(公告)日：2022-08-11

申请号：US17589124

申请日：2022-01-31

申请人： Canton Litho Material Technology Inc.

发明人： Hai DENG ,  Min CAO

IPC分类号： G03F7/038 ,  C08F30/08 ,  C08F20/18

摘要： A resin including a highly sequenced copolymer is presented, and the preparation and application of its resist composition is presented. The resist has excellent performance and can promote the development of integrated circuits.

公开(公告)号：US11261265B2

公开(公告)日：2022-03-01

申请号：US16521864

申请日：2019-07-25

申请人： PPG INDUSTRIES OHIO, INC.

发明人： Shanti Swarup ,  Deena M. McHenry ,  David Walters

IPC分类号： C08F2/20 ,  C08F20/18 ,  C08F20/32 ,  C08F20/34 ,  C08F30/08 ,  C08L75/02 ,  C08L75/04 ,  C09D133/06 ,  C09D133/08 ,  C09D133/14 ,  C09D143/04

摘要： The present invention is directed to an acrylic polymer prepared from a reaction mixture comprising: (i) an ethylenically unsaturated monomer comprising hydroxyl functional groups; (ii) an ethylenically unsaturated monomer comprising polydialkylsiloxane groups; (iii) an ethylenically unsaturated monomer comprising carboxylic acid functional groups or amine functional groups; and (iv) a reactive diluent that is reactive with the ethylenically unsaturated monomer (iii). The reactive diluent (iv) is present initially in the reaction mixture as a medium in which the monomers polymerize. The present invention is further directed to aqueous polymeric dispersions prepared therefrom and aqueous, curable film-forming compositions prepared from the dispersions. The curable film-forming compositions are low VOC and are useful in methods of mitigating dirt build-up on a substrate.

公开(公告)号：US11192349B2

公开(公告)日：2021-12-07

申请号：US16082201

申请日：2017-03-02

申请人： BOREALIS AG

发明人： Jeroen Oderkerk ,  Bert Broeders ,  Bernt-Ake Sultan ,  Girish Suresh Galgali ,  Stefan Hellstrom ,  Mattias Bergqvist ,  Bart Verheule ,  Kristina Akyuz-Karlsson ,  Urban Andreasson ,  Francis Costa ,  Anh Tuan Tran

IPC分类号： B32B27/32 ,  B32B17/10 ,  B32B27/28 ,  B32B27/30 ,  C08F30/08 ,  C08L23/08

摘要： The invention is a polymer composition for film layer comprising less than 50 wt % of a copolymer of ethylene with silane group(s) containing units and at least 50 wt % of a thermoplastic polyolefine free from silane group(s) wherein the polymer composition has creep of less than 1 mm at 90° C., and an adhesion above 20 N/cm. The invention relates to a laminated article with at least one film layer of the polymer composition and a substrate.

公开(公告)号：US11060005B2

公开(公告)日：2021-07-13

申请号：US15771818

申请日：2016-10-10

申请人： TESA SE

发明人： Christian Schuh ,  Alexander Prenzel ,  Sarah Bamberg

IPC分类号： C09J143/04 ,  C08F220/18 ,  C09J7/38 ,  C08F220/32 ,  C08F230/08 ,  C08F30/08 ,  C08F20/32

摘要： The present invention relates to a cationically polymerizable composition comprising or consisting of: (a1) 35 to 90 wt % of at least one (meth)acrylic ester of the general formula (I) in which R1 is selected from H and CH3 and R2 is a linear or branched alkyl chain having 1 to 30 carbons; (a2) 5 to 30 wt % of at least one olefinically unsaturated monomer having at least one cationically polymerizable functional group; (a3) 5 to 30 wt % of at least one alkoxysilane-modified (meth)acrylic ester; (a4) optionally 5 to 30 wt % of at least one N-vinyl-substituted lactam; and (a5) optionally up to 5 wt % of at least one (meth)acrylic ester different from (a1) and/or of at least one olefinically unsaturated monomer which is copolymerizable with components (a1) to (a4). The invention further relates to a pressure sensitive adhesive and also to a structural pressure sensitive adhesive, which are obtainable by polymerization and optional subsequent additional crosslinking of such a composition, and also to the use of these pressure sensitive adhesives.

公开(公告)号：US11020825B2

公开(公告)日：2021-06-01

申请号：US15767804

申请日：2016-11-18

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Mai Yamagami ,  Satoshi Haneda ,  Takeshi Wakiya ,  Yasuyuki Yamada ,  Saori Ueda ,  Masao Sasadaira

IPC分类号： B23K35/36 ,  B23K35/02 ,  B23K35/30 ,  C08F216/06 ,  C08F212/36 ,  C08F36/20 ,  C09J9/02 ,  B23K35/34 ,  B22F7/08 ,  C08F30/08 ,  C08J3/12 ,  C08F16/32 ,  C08F36/08 ,  H01B1/22 ,  H01R11/01 ,  C09J11/00 ,  C09J201/00 ,  H01B5/00 ,  B23K35/26 ,  B22F1/00 ,  B22F1/02 ,  B22F7/06 ,  C08K3/08 ,  B23K35/24 ,  C08K7/00

摘要： A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

公开(公告)号：US11017916B2

公开(公告)日：2021-05-25

申请号：US15767803

申请日：2016-11-18

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： Mai Yamagami ,  Satoshi Haneda ,  Takeshi Wakiya ,  Yasuyuki Yamada ,  Saori Ueda ,  Masao Sasadaira

IPC分类号： B23K35/36 ,  B23K35/02 ,  B23K35/30 ,  C08F216/06 ,  C08F212/36 ,  C08F36/20 ,  C09J9/02 ,  H01B1/22 ,  B22F7/08 ,  C08F30/08 ,  C08F36/08 ,  H01R11/01 ,  C08F16/32 ,  H01B5/00 ,  C09J201/00 ,  B23K35/26 ,  B22F7/06 ,  B22F1/02 ,  B23K35/24 ,  C08F12/36 ,  C09J11/08 ,  C08F16/20 ,  C08G61/02 ,  H01L23/00 ,  B22F1/00

摘要： Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

公开(公告)号：US20200157256A9

公开(公告)日：2020-05-21

申请号：US15993002

申请日：2018-05-30

申请人： AGC Inc.

发明人： Keisuke TAKAGI ,  Jun YOSHIDA ,  Hidenobu MUROFUSHI

IPC分类号： C08F20/14 ,  C08F20/22 ,  C08F20/28 ,  C08F20/56 ,  C08F30/08 ,  C08F2/48 ,  C09C1/30

摘要： To provide a curable composition whereby it is possible to obtain a cured product having a high Abbe number and being excellent in transparency, crack resistance and releasability; and such a cured product. A curable composition comprises, in specific ratios, surface-modified metal oxide particles (A) having (meth)acryloyl-group-containing surface-modifying groups on the surface of the metal oxide particles, a compound (B) having a fluorine atom and at least one (meth)acryloyl group, a compound (C) having a urethane bond or —OCH2CH(OH)CH2—, having at least two (meth)acryloyl groups and having a mass-average molecular weight of at least 1,000, a compound (D) having no unsaturated bond-containing ring structure and having at least one (meth)acryloyl group, and a polymerization initiator (E).

公开(公告)号：US10476014B2

公开(公告)日：2019-11-12

申请号：US14953884

申请日：2015-11-30

申请人： Samsung Electronics Co., Ltd.

发明人： Eun Kyung Lee ,  Jiyoung Jung ,  Jeong Il Park ,  Ajeong Choi

IPC分类号： H01L51/05 ,  H01L51/10 ,  C08F30/08 ,  C08L43/04 ,  C09D183/08 ,  C09D183/10 ,  C08L83/08 ,  C08L83/10 ,  C09D4/00 ,  C08G77/14 ,  C08G77/20 ,  C08G77/26 ,  C08G77/442 ,  H01L51/00

摘要： A composition includes a product of a condensation reaction between a thermal cross-linking agent and a product of hydrolysis and condensation polymerization of a compound represented by Chemical Formula 1.