公开(公告)号：US20240308023A1

公开(公告)日：2024-09-19

申请号：US18587894

申请日：2024-02-26

申请人： EBARA CORPORATION

发明人： YUSUKE MOCHIDA

IPC分类号： B24B37/34 ,  B24B53/017

CPC分类号： B24B37/34 ,  B24B53/017

摘要： A cover assembly includes a cover cleaning part covering at least a portion of an outer peripheral surface of a rotating body. The cover cleaning part includes: an outer cover part, constituting an outer surface of the cover cleaning part; an inner cover part, constituting at least a portion of an inner surface of the cover cleaning part; a fluid chamber, formed between the outer cover part and the inner cover part; and a cleaning liquid supply port, provided in the outer cover part or the inner cover part, communicating with the fluid chamber, and for supplying a cleaning liquid to the fluid chamber. The inner cover part includes at least one cleaning liquid discharge port communicating with the fluid chamber and facing the outer peripheral surface of the rotating body.

公开(公告)号：US11986925B2

公开(公告)日：2024-05-21

申请号：US17977794

申请日：2022-10-31

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Michael J. Coughlin ,  Allen L. D'Ambra

IPC分类号： B24B53/017 ,  B05C17/00 ,  B24B37/34 ,  B65D47/42 ,  B65D81/32 ,  C09D5/00 ,  B05D1/28 ,  B05D5/08

CPC分类号： B24B53/017 ,  B05C17/00 ,  B24B37/34 ,  B65D81/3266 ,  C09D5/00 ,  B05D1/28 ,  B05D5/08 ,  B65D47/42

摘要： Chemically impregnated applicators used to provide hydrophobic surfaces on chemical mechanical polishing system components and related application methods are shown. A method of forming a hydrophobic coating on a surface of a polishing system component includes cleaning the surface of the polishing system component to remove a polishing fluid residue therefrom and applying a hydrophobicity causing chemical solution to the surface of the polishing system component.

公开(公告)号：US20240033876A1

公开(公告)日：2024-02-01

申请号：US18352325

申请日：2023-07-14

申请人： EBARA CORPORATION

发明人： Shumpei MIURA ,  Kenichi SUZUKI ,  Itsuki KOBATA ,  Yasuyuki MOTOSHIMA ,  Ban ITO ,  Seungho YUN

IPC分类号： B24B37/015 ,  B24B37/34

CPC分类号： B24B37/015 ,  B24B37/34

摘要： A polishing apparatus is disclosed, which is capable of heating and maintaining a temperature distribution of a polishing pad at a predetermined temperature distribution with a simple structure. The polishing apparatus has a pad-temperature regulating apparatus for regulating a temperature of a polishing surface, and the pad-temperature regulating apparatus includes a heating-fluid nozzle arranged above and spaced apart from the polishing surface. The heating-fluid nozzle includes: a nozzle body; a slit formed along a longitudinal direction of the nozzle body for ejecting a heating fluid toward the polishing surface; a header tube which is formed within the nozzle body and into which the heating fluid is supplied; a buffer tube which is formed within the nozzle body and communicates with the slit, and a plurality of branch tubes for coupling the header tube to the buffer tube.

公开(公告)号：US20230356351A1

公开(公告)日：2023-11-09

申请号：US18356604

申请日：2023-07-21

申请人： Applied Materials, Inc.

发明人： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang

IPC分类号： B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02

CPC分类号： B24B37/015 ,  B24B37/105 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  B24B49/14

摘要： A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.

公开(公告)号：US20230352326A1

公开(公告)日：2023-11-02

申请号：US18349666

申请日：2023-07-10

申请人： EBARA CORPORATION

发明人： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC分类号： H01L21/67 ,  B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34 ,  H01L21/304 ,  H01L21/306 ,  H01L21/02

CPC分类号： H01L21/67248 ,  H01L21/67178 ,  H01L21/67109 ,  H01L21/67051 ,  H01L21/67046 ,  H01L21/67028 ,  H01L21/67219 ,  B24B37/105 ,  B24B49/14 ,  B24B53/017 ,  B24B37/345 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/6704 ,  H01L21/02065 ,  H01L21/02052

摘要： A polishing apparatus is provided. The polishing apparatus includes:



a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

公开(公告)号：US20230286108A1

公开(公告)日：2023-09-14

申请号：US17931948

申请日：2022-09-14

申请人： Samsung Electronics Co., Ltd.

发明人： Donghoon Kwon ,  Hyojung Kim ,  Chungki Min ,  Kihoon Jang

IPC分类号： B24B55/02 ,  B24B57/02 ,  B24B37/10 ,  B24B37/34 ,  B24B53/017

CPC分类号： B24B55/02 ,  B24B57/02 ,  B24B37/107 ,  B24B37/34 ,  B24B53/017

摘要： A polishing apparatus for a substrate, includes: a platen having a polishing pad attached to an upper surface thereof, and configured to rotate in a rotational direction, a temperature control unit configured to spray a temperature control fluid onto the polishing pad, a slurry supply unit configured to supply a slurry to the polishing pad, a polishing head on the polishing pad, and configured to rotate a semiconductor substrate in contact with the polishing pad, and a first fence between the temperature control unit and the slurry supply unit extending from a center outwardly, along the rotational direction, to control a flow of the temperature control fluid, wherein the temperature control unit, the slurry supply unit, and the polishing head are sequentially positioned along the rotational direction.

公开(公告)号：US20230249312A1

公开(公告)日：2023-08-10

申请号：US18301221

申请日：2023-04-15

申请人： TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO., LTD.

发明人： Jianmin XU ,  Jie DING ,  Yong ZHANG ,  Liang WANG ,  Hao SU ,  Jianxing DI ,  Jianjun HAO ,  Yingchun ZHANG ,  Huaen WANG ,  Xianling ZHANG ,  Lizhi CUI

IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B37/32 ,  B24B37/34

CPC分类号： B24B37/044 ,  B24B37/105 ,  B24B37/32 ,  B24B37/34

摘要： A large area quartz crystal wafer lapping device, provided with a base, a supporting arm assembly, a lapping plate, a swivel gantry, a rotating motor, a loading block and a plate-Adjusting ring; The supporting arm assembly comprises a swing arm, a swing arm shaft, a swing arm motor, an adjustable arm and a roller; The swivel gantry is driven to rotate by the rotating motor; The loading block is encased in the plate-Adjusting ring, and a quartz crystal wafer is bonded to the bottom surface of the loading block. In the invention, through the improved design of material removal and wafer retention, the processing surface shape of large area quartz crystal wafer can meet the design requirements.

公开(公告)号：US20230182259A1

公开(公告)日：2023-06-15

申请号：US18107220

申请日：2023-02-08

申请人： Applied Materials, Inc.

发明人： Surajit Kumar ,  Hui Chen ,  Chih Chung Chou ,  Shou-Sung Chang

IPC分类号： B24B37/015 ,  B24B37/34

CPC分类号： B24B37/015 ,  B24B37/34

摘要： A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

公开(公告)号：US20230158634A1

公开(公告)日：2023-05-25

申请号：US17965497

申请日：2022-10-13

申请人： Industrial Technology Research Institute

发明人： CHIH-CHIEH SU ,  KO-CHIEH CHAO ,  CHUN-HSIEN SU

IPC分类号： B24B41/00 ,  B24B57/04 ,  B24B41/02 ,  B24B37/34

CPC分类号： B24B41/005 ,  B24B37/34 ,  B24B41/02 ,  B24B57/04

摘要： A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.

公开(公告)号：US20230146929A1

公开(公告)日：2023-05-11

申请号：US18091309

申请日：2022-12-29

申请人： Applied Materials, Inc.

发明人： Shantanu Rajiv Gadgil ,  Sumit Subhash Patankar ,  Nathan Arron Davis ,  Allen L. D`Ambra

IPC分类号： H01L21/67 ,  B24B37/27 ,  B08B3/00 ,  B08B1/04 ,  B24B37/34

CPC分类号： H01L21/6704 ,  B24B37/27 ,  B08B3/003 ,  B08B1/04 ,  B24B37/34 ,  B24B37/12

摘要： In a chemical mechanical polishing system, a platen shield cleaning assembly is installed on a rotatable platen in a gap between the rotatable platen and a platen shield. The assembly includes a sponge holder attached to the platen and a sponge. The sponge is held by the sponge holder such that an outer surface of the sponge is pressed against an inner surface of the platen shield.