发明公开
- 专利标题： CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL
-
申请号： US18356604申请日： 2023-07-21
-
公开(公告)号： US20230356351A1公开(公告)日： 2023-11-09
- 发明人: Hari Soundararajan , Shou-Sung Chang , Haosheng Wu , Jianshe Tang
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： B24B37/015
- IPC分类号： B24B37/015 ; B24B37/10 ; B24B37/22 ; B24B37/34 ; B24B55/02
摘要：
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.
信息查询
