Abstract:
A method and apparatus for detecting radiation including x-ray, gamma ray, and particle radiation for radiographic imaging, and nuclear medicine and x-ray mammography in particular, and material composition analysis are described. A detection system employs fixed or configurable arrays of one or more detector modules comprising detector arrays which may be electronically manipulated through a computer system. The detection system, by providing the ability for electronic manipulation, permits adaptive imaging. Detector array configurations include familiar geometries, including slit, slot, plane, open box, and ring configurations, and customized configurations, including wearable detector arrays, that are customized to the shape of the patient. Conventional, such as attenuating, rigid geometry, and unconventional collimators, such as x-ray optic, configurable, Compton scatter modules, can be selectively employed with detector modules and radiation sources. The components of the imaging chain can be calibrated or corrected using processes of the invention. X-ray mammography and scintimammography are enhanced by utilizing sectional compression and related imaging techniques.
Abstract:
Programmable circuit structures having reduced susceptibility to single event upsets. A circuit structure includes a programmable circuit controlled by a group of memory cells, of which at most one has an enable value. The memory cells are coupled together such that if any one memory cell in the group is at the enable value, then all other memory cells in the group are forced to a disable value. If a single event upset occurs at any of the disabling memory cells the value in the memory cell does not change, because the memory cell is being held disabling by the one enabling memory cell. However, if a single event upset occurs at the enabling memory cell, causing it to become disabling, a circuit error occurs. Thus, the susceptibility of the circuit structure has been reduced by a factor of (N−1)/N, where N is the number of memory cells.
Abstract:
An integrated circuit assembly that includes an integrated circuit which is connected to an interposer. The integrated circuit may include a logic circuit which generates an output signal. The interposer may include a driver circuit that regenerates the output signal. The interposer may also contain a clock signal that is connected to the logic circuit. Separating the driver circuit from the integrated circuit may provide an assembly which reduces the amount of noise in the logic circuit created by the driver circuit switching states. Additionally, providing the clock circuit on the interposer allows the clock to be fabricated with a more robust process than the logic circuit of the integrated circuit.
Abstract:
A microprocessor assembly is located on a daughterboard, which is configured to be physically and electrically coupled to a motherboard. One of the electrical terminals in an electrical connector between the daughterboard/motherboard is coupled to either a ground or a voltage supply Vdd on the daughterboard, depending on the type of microprocessor used. The electrical connector passes either the ground or Vdd signal to a semiconductor device on the motherboard to automatically identify the type of microprocessor on the daughterboard.
Abstract:
An X-ray detecting device and a fabricating method thereof capable of preventing a short between a lower electrode of a capacitor and a data line are presented. In the device, a data line insulating layer is formed to cover the data line and a gate line. The gate line is exposed through a contact hole defined in the data line insulating. Then a lower electrode is formed on the data line insulating layer and is electrically connected to the gate line via the contact hole. Subsequently, an upper electrode is formed to complete the device. The data line insulating layer prevents a short between the data line and the lower electrode when residual conductive materials are formed when the lower electrode is formed.
Abstract:
A device having two or more programmable logic devices within an assembly apparatus. A first programmable logic device may be configured to have (i) a first signal interface and (ii) a second signal interface. A second programmable logic device may be configured to have (i) a third signal interface and (ii) a fourth signal interface. The assembly apparatus is generally configured to (i) mount the first programmable logic device and (ii) mount the second programmable logic device. A first external contact may be connected to the first signal interface. A second external contact may be connected to the fourth signal interface. A direct connection may be provided between the second signal interface and the third signal interface.
Abstract:
A fixing member for fixing a solar cell module or a roofing member with no solar cell onto an installation face, said fixing member comprising a meshing portion to mesh at least a solar cell module or a part of a roofing member with no solar cell; a fixing portion to fix said fixing member to said installation face; and a raised portion to connect said meshing portion and said fixing portion, wherein said raised portion has a height which is greater than the thickness of a portion of said solar cell module or said roofing member which is engaged in the meshing by said meshing portion.
Abstract:
Depletion mode pass transistor (38) accepts input voltage Vin and provides regulated output voltage Vout. The regulated output voltage is referenced to the threshold voltage of MOSFET (40) and is directly proportional to the ratio of resistors (50 and 52). MOSFET (58) provides enabling and disabling of voltage regulator (54). Multiple voltage regulators (FIG. 5) having multiple output potentials are realized on the same semiconductor die producing the same threshold potential for MOSFET's (40), whereby the output potentials are selectable using the ratio of resistors 50 and 52. Constant current source (56) reduces output voltage variation due to input voltage variation.
Abstract:
An electronic apparatus having a multiplicity of operably connected semiconductor integrated circuits (ICs) arranged on a substrate and operable at different operating voltages. The interface voltages between two ICs is set to the lowest operating voltage of the ICs. Each IC other than those operating at the lowest operating voltage has an input circuit for converting the lowest operating voltage of an input signal to its operating voltage and an output circuit for converting the voltage of its output signal to the lowest operating voltage.
Abstract:
A multi-design integrated circuit having I/O buffers that are shared by multiple designs in the integrated circuit, the multi-design integrated circuit being designed by combining netlists and pin-pad assignment lists for the individual designs into one overall netlist or multi-design netlist.