公开(公告)号：US06929897B2

公开(公告)日：2005-08-16

申请号：US10921488

申请日：2004-08-19

Applicant: Patrick Foster ,  Gregory Spaziano ,  Binod B De

Inventor： Patrick Foster ,  Gregory Spaziano ,  Binod B De

IPC: C08F24/00 ,  C08F30/08 ,  C08F220/18 ,  C08F222/06 ,  C08F230/08 ,  G03C1/76 ,  G03F20060101 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075 ,  G03F7/09 ,  G03F7/20 ,  G03F7/30 ,  G03F7/36 ,  G03F7/034 ,  G08F24/00 ,  G08F30/08

CPC classification number: C08F220/18 ,  C08F222/06 ,  C08F230/08 ,  G03F7/0045 ,  G03F7/0758 ,  Y10S430/106 ,  Y10S430/108 ,  Y10S430/11 ,  Y10S430/111 ,  Y10S430/115 ,  Y10S430/122 ,  Y10S430/126

Abstract: Polymers and co-polymers having monomeric units formed by the polymerization of monomers of the Structure I where R1 is a moiety containing an ethylenically unsaturated polymerizable group, R2 is a C1-C3 alkylene group, and R3 is a C1-10 linear or cyclic alkyl group, a C6-10 aromatic or substituted aromatic group, a C1-8 alkoxy methyl, or a C1-8 alkoxy ethyl group, are useful as binder resins for photosensitive compositions, and processes for photolithography in the production of semiconductor devices and materials.

Abstract translation: 具有由结构I的单体聚合形成的单体单元的聚合物和共聚物，其中R 1是含有烯属不饱和可聚合基团的部分，R 2是C C 1 -C 3亚烷基，R 3是C 1-10烷基直链或环状的烷基， C 6-10芳族或取代的芳族基团，C 1-8烷氧基甲基或C 1-8烷氧基乙基， 可用作光敏组合物的粘合剂树脂，以及用于半导体器件和材料的制造中的光刻工艺。