Heat exchanger and air-conditioning apparatus including the heat exchanger

    公开(公告)号:US12152814B2

    公开(公告)日:2024-11-26

    申请号:US17912925

    申请日:2020-05-22

    Abstract: A heat exchanger includes a plurality of heat exchange units each including a plurality of flat tubes, a plurality of fins, an upper header, and a lower header. In the plurality of heat exchange units, the upper headers are connected such that the upper headers communicate with each other, and the lower headers are connected such that the lower headers communicate with each other through an opening-closing valve. The heat exchanger has a configuration in which when the heat exchanger serves as a condenser, the opening-closing valve is controlled such that refrigerant in at least one of the plurality of heat exchange units flows in an upward direction, and refrigerant in the other one or the other ones of the plurality of heat exchange units flows in a downward direction.

    VAPOR CYCLE SYSTEM FOR COOLING COMPONENTS AND ASSOCIATED METHOD

    公开(公告)号:US20240384907A1

    公开(公告)日:2024-11-21

    申请号:US18788644

    申请日:2024-07-30

    Abstract: A vapor cycle system for cooling components includes a refrigeration circuit through which a mass of a refrigerant flows. The refrigeration circuit, in turn, includes a compressor, a first condenser, a second condenser fluidly coupled to the first condenser in series, an expansion valve, and an evaporator. Furthermore, the system includes a refrigerant charge control device configured to increase or decrease the mass of the refrigerant flowing through the refrigeration circuit, wherein the refrigerant charge control device comprises a storage device.

    MECHANICAL-COOLING, FREE-COOLING, AND HYBRID-COOLING OPERATION OF A CHILLER

    公开(公告)号:US20240255197A1

    公开(公告)日:2024-08-01

    申请号:US18630826

    申请日:2024-04-09

    Abstract: A chiller system includes a mechanical-cooling circuit configured to circulate a refrigerant through an evaporator of the mechanical-cooling circuit, where the evaporator is configured to cool a conditioning fluid with the refrigerant. The chiller system also includes a free-cooling circuit configured to circulate the refrigerant through a heat exchanger of the free-cooling circuit, where the heat exchanger is configured to cool the conditioning fluid with the refrigerant. The chiller system also includes a distribution header having a first inlet configured to receive the refrigerant from the mechanical-cooling circuit, a second inlet configured to receive the refrigerant from the free-cooling circuit, and an internal volume fluidly coupled to the first inlet and the second inlet. A fan coil unit of the chiller system is configured to receive the refrigerant from the internal volume of the distribution header.

    HEAT EXCHANGER AND AIR-CONDITIONING APPARATUS INCLUDING THE HEAT EXCHANGER

    公开(公告)号:US20230148118A1

    公开(公告)日:2023-05-11

    申请号:US17912925

    申请日:2020-05-22

    CPC classification number: F25B30/02 F25B41/20 F25B6/04

    Abstract: A heat exchanger includes a plurality of heat exchange units each including a plurality of flat tubes, a plurality of fins, an upper header, and a lower header. In the plurality of heat exchange units, the upper headers are connected such that the upper headers communicate with each other, and the lower headers are connected such that the lower headers communicate with each other through an opening-closing valve. The heat exchanger has a configuration in which when the heat exchanger serves as a condenser, the opening-closing valve is controlled such that refrigerant in at least one of the plurality of heat exchange units flows in an upward direction, and refrigerant in the other one or the other ones of the plurality of heat exchange units flows in a downward direction.

    System and method for phase-change cooling of an electronic rack

    公开(公告)号:US11612083B2

    公开(公告)日:2023-03-21

    申请号:US17194143

    申请日:2021-03-05

    Applicant: Baidu USA LLC

    Inventor: Tianyi Gao

    Abstract: According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.

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